Coollaboratory Liquid Ultra 1g

Pasty liquid metal alloy based on gallium, indium, silver, tin and bismuth for use as a high-quality thermal interface. Aimed at demanding users and overclocking enthusiasts. Able to fully replace thermal paste in many systems with high heat dissipation. It features an impressive thermal conductivity of 38 W/m∙K, which is 4-6 times greater than the best branded thermal pastes. Due to this, when used correctly, it provides low thermal resistance at the point of contact between the heat spreader of the chip and the base of the radiator.

The operating range of the liquid metal alloy is from 10 to 140 °C, which allows it to be used in air and liquid cooling systems. Liquid Metal can work effectively on PC/Laptop CPUs and GPU GPUs. The Coollaboratory Liquid Ultra 1g thermal interface is able to cope with impressive heat fluxes, the transfer of which is important for both successful overclocking and stable operation. Supplied in a bag containing a plastic syringe with 1 g of the alloy, a damp alcohol wipe, a pair of brushes for application, a sponge for removing liquid metal residues and instructions that must be strictly followed. Works well on nickel or copper surfaces (pure copper). It is strictly forbidden to apply on aluminium and its alloys.